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As global semiconductor and High-Performance Computing(HPC) technologies are pushed to their absolute limits, the entire advancedpackaging supply chain is facing a physical dead end where three major areasare collapsing simultaneously due to the thermal crisis: I.The Stock-Pumping Scam of Large-Size FOPLP and Glass Substrates: The AbsurdHigh-Stakes Gamble from 12-Inch Wafers to 20-Inch Broken Tiles The industry and capital markets are fanatically hyping  (a full 20 inches)Panel-Level Fan-Out Packaging (FOPLP) and glass substrates. This is aninternational joke led by amateurs lacking fundamental domain expertise! - Geometric Dead Ends and the Edge-Loss Lie: For traditional 12-inch circular wafers, even if there is minor edge loss, it is a normal, controllable loss that conforms to physical geometry. Furthermore, edge loss is inherently the cost of the customer (the design company); why on earth are wafer foundries panicking and making a fuss about it?
- In contrast, for the
 square broken tile, chip sizes are dictated by computing logic, and the dimensions of every chip vary. It is utterly impossible for them to fit neatly into that rigid grid layout! This forced layout results in even more severe and wasteful geometric dead zones around the edges. - Corner Stress and Total Panel Shattering: Circular shapes possess a natural physical advantage in stress distribution. However, the four 90-degree right angles of a 20-inch large square become the "death triangle zone" where mechanical and thermal stress concentrate during high-temperature, TGV, and chemical corrosion processes. Even a slight imbalance won't just result in a few lost edges—the entire 20-inch large board will directly warp, delaminate, and shatter into total scrap!
- If FOPLP were truly viable, why not transition steadily from 10-inch or 12-inch circular boards instead of making a reckless leap to sheets that shatter entirely? To put it bluntly, this is merely a gimmick pushed by individuals from a panel-manufacturing background, attempting to use large-size visual spectacles to scam subsidies and hype up distant visions during earnings conferences.
II.The Deception and Physical Bankruptcy of Chip Micro-Channel Cooling:The Illusion of High-Pressure Steam Bombs Take current flagship AI chips (such as the monstrous H200consuming upwards of 700W) as an example. At full speed, it franticallygenerates a massive amount of heat reaching 700 Joules per second (  ). However, under thefluid resistance of narrow micro-channels within the chip, the hyped"micro-channel cooling" cannot even push through  of cooling liquid persecond. The vast disparity of over a hundredfold between fluid volume andthermal energy generation causes the coolant to instantly boil, vaporize, andrapidly expand into high-pressure steam bombs right inside the micro-channelsupon touching hot spots, threatening to crack the chip's base at any moment!This is not cooling; it is accelerating the chip's destruction. Do the expertshyping micro-channel cooling lack basic brains, fluid dynamics, andphase-transition common sense? III.The Pseudoscientific Scam of CPO and NPO Silicon Photonics: The100x Production Capacity Pie in the Sky and the 400mW Physical Dead End In ultra-short-distance transmissions between chips,blindly forcing CPO or hastily pivoting to NPO (Near-Package Optics) as atransition is nothing more than a semantic word game, with the"four-stage" slogans shouting to the high heavens! Even that weaselsneaked away in panic and failed to set up a single exhibition booth at thisyear's expo, which says it all! - The 100x Capacity Void Admitted by Themselves: Industry unicorns have openly confessed that the current core bottleneck lies in testing capacity (limited to prototype production stage), with wafer-level testing equipment being extremely scarce. To meet future demand, overall production capacity must expand to 100 times its current scale. Failing basic testing equipment by an astronomical margin, they still brazenly feed the market pies by hyping commercialization by 2027 and 2028!
- The 400mW Physical Ceiling: The power of a single laser has approached the physical limit of roughly 400 milliwatts. To increase bandwidth, one is forced to blindly cram in more lasers. With supply-side expansion lagging far behind demand, hyping lasers and optical fibers as "the next HBM" tramples basic physical common sense underfoot.
- Whether CPO or NPO, signal transmission must still go through complex encoding/decoding and dual photoelectric conversions (E/O and O/E). This not only doubles latency and spikes costs but becomes the final straw breaking the system.
OurUltimate Breakthrough Solution (Patent Filed) Faced with these intractable heating dilemmas in theindustry, our team has successfully developed two breakthrough solutionsthrough long-term foundational physical reasoning. Relevant invention patents have now been officially filed: 1. Copper-FreeSolid-State Direct-Conduction and Substrate Anti-Warping System: Completely discarding copper and aluminum alloycooling structures with poor thermal conductivity, we adopt a metal-free bareboard paired with an original high-conductivity design. Through solid-statedirect conduction and ultra-fast thermal dissipation, the heat dissipationefficiency from the chip is over 300% higher than traditional top-tier coolingmethods. Using pure solid-state high-efficiency thermal conduction to rapidlyguide the violent 700-joule-per-second heat source away from the chip, it completelyshatters the myths of chip micro-channel cooling and bulky thermal designs,extending substrate and chip lifespans by multiple folds. Material costs arefar lower than traditional cooling, and thermal devices require zeromaintenance forever, directly delivering a death sentence to the blind waitingfor glass substrates and chip micro-channel cooling during the transitionperiod. 2. Area Wastein Chip Substrates and System Circuit Boards Stems from Uncontrollable Heat: The warping of existing chip ABF substrates iscaused solely by chip overheating. The root culprit lies in flawed circuitdesign; current EDA or semi-EDA chip circuits and circuit boards face majorstructural errors. EDA only knows how to design system logic gates, notelectronic circuits. With the industry unable to eliminate chip overheating,everyone pins their hopes on self-comforting lies about FOPLP, chipmicro-channel cooling, and CPO by 2028. Effectively eliminating abnormal heatfrom chips and transmission lines ensures that ABF substrates will never warp.Whether on chips or system motherboards, large areas of parallel data andaddress bus lines can be neatly hidden inside PCB interlayers rather thanexposed on the surface for cooling, saving at least 30% of PCB area and cuttingpower consumption by over 50%. If your esteemed company is encountering insurmountablebottlenecks in current advanced packaging processes, substrate anti-warping, orhigh-heat chip thermal dissipation, please feel free to contact and discusswith us at any time. We are happy to conduct preliminary discussions oncutting-edge technology verification and subsequent cooperation plans beforeour patents are officially published.
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